DIC and Unitika Collaborate to Develop a Specialty PPS Movie with Low Dielectric Properties Appropriate for Use in a Key Materials for Millimeter-Wave Printed Circuit Boards and Millimeter-Wave Radar

TOKYO — DIC Company (TOKYO:4631) introduced at present that it has developed a brand new specialty polyphenylene sulfide (PPS) movie in collaboration with Japanese agency Unitika Ltd. that suppresses transmission loss at excessive frequencies. This product’s low dielectric properties make it appropriate to be used in a key for millimeter-wave printed circuit boards suitable with next-generation communications gadgets and for millimeter-wave radar. This new PPS movie has already been evaluated by quite a lot of electronics supplies producers and preparations are presently being made to begin business manufacturing.

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Typical high-frequency versatile printed circuit boards utilized in smartphones and small digital gadgets, amongst others, are fabricated by bonding layers of liquid crystal polymer (LCP) movie and copper foil. LCP creates in an uneven movie–copper foil adhesive interface, a trigger of upper transmission loss. As a result of next-generation communication gadgets use the millimeter-wave frequency band (30 to 300 GHz), they require supplies with low dielectric properties, which decrease transmission loss.

The specialty PPS movie developed by DIC and Unitika combines the previous’s proprietary PPS polymerization and compounding applied sciences with Unitika’s movie manufacturing applied sciences. This new movie maintains the low moisture absorption, in addition to the flame and chemical resistance, of PPS resin, whereas delivering the excellent low dielectric properties, dimensional stability, reflow resistance and uniformity of thickness required for high-frequency printed circuit boards. Specifically, this product demonstrates secure dielectric properties in high-temperature environments and at a variety of frequencies (10 to 1,000 GHz), a efficiency characteristic troublesome to attain with LCP or different frequent movies, on account of which it’s anticipated to be adopted for all kinds of functions, from smartphones to vehicles.

This new movie additionally boasts wonderful adhesiveness with completely different supplies, which means that it’s suitable with a broad vary of versatile copper clad laminate (FCCL) processing strategies, together with sputtering and plating, in addition to lamination with an adhesive. The sputtering and plating methodology, particularly, delivers a easy adhesive interface that achieves decrease transmission loss than generally used movies, together with LCP or fluoropolymers.

The DIC Group is contributing to digitalization by growing useful supplies that anticipate rising wants within the growth of infrastructure for next-generation communications, together with 5G/6G, and generative AI, that are anticipated to see accelerated demand within the years forward.

About DIC Company
DIC Company is likely one of the world’s main high quality chemical substances firms and the core of the DIC Group, a multinational group comprising about 180 firms, together with Solar Chemical Company, in additional than 60 nations and territories. The DIC Group is acknowledged as a world chief within the markets for a wide range of merchandise important to trendy existence, together with packaging supplies, show supplies comparable to these utilized in tv and pc shows, and high-performance supplies for smartphones and different digital gadgets, in addition to for vehicles.
Web site: https://www.dic-global.com/en/